| 标准号 | IEC/TS 61967-3 ed2.0 |
| 标准名称 | Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method |
| 发布日期 | 2014-08-25 |
| 国际标准分类号(ICS) | 31.200Integrated circuits. Microelectronics*Including electronic chips, logical and analogue microstructures*Microprocessors, see 35.160 |
| 技术委员会 | 47A- Integrated circuits |
| 稳定期 | 2019 |
| 摘要 | IEC TS 61967-3:2014 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain. This edition includes the following significant technical changes with respect to the previous edition:a) Removal of: Clause 9.4 Data analysis and Annex D Analysing the data from near-field surface scanning;b) Addition of: Introduction, Clause 9.4 Measurement data, Clause 9.5 Post-processing, Clause 9.6 Data exchange and Annex D Coordinate systems;c) Expansion of: Clause 8.4 Test technique and Annex A Calibration of near-field probes. |
| 来源 | IEC |
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